Sounds like you're in the same boat as me. Just can't seem to justify the expense of a hot air rework station, they're not cheap. I threw my board in a frying pan with a temperature probe to remove the damaged chip. Not something I could do more than once I think, but it allowed me to salvage that particular build. The failed chip was in a DFN package which is solderable by hand, but impossible to unsolder by hand because of the heat sink pad underneath. I've also got my various screwy methods of removing ICs. The magnet wire trick sounds like a good one. Have to try that next time.