You use terms "power" and "structure", as seemingly interchangeable elements... neither of which are specific. The true limiting elements will be heat, air pressure/vacuum, and chemical in nature.
RDAs don't necessarily have a resistance "lower limit"... other than temperature effects on what ever type of insulation is used for the positive terminal. as well as the cap and/or drip tip o-rings.
To the above, one could include (perhaps) the drip tip/chuff cap... and what the user can tolerate on their lips.
PEEK thermoplastic, the most preferred insulation material for
rda positive center posts, has a melting point of 650F°.
With
rta/modern glassomizers... the above will apply as well. As the majority of RTA/glassomizers are constructed of stainless steel and (most commonly) borosilicate glass, that leaves the few that use some form of generic polycarbonate for the transparent housing. Polycarbonate has a melting point of 311F° and a upper working temperature of 239–266F°.
RTA/glassomizers also contain a number of o-rings... which can be a critical variable, as they must tolerate heat,
and provide an air tight, e-liquid seal.
Below are some generic values for common materials.
Unless the maker offers specific information, your most likely o-ring material will be silicone rubber.
Viton 75: -20° to +400F°
EPDM: -65F° to +300F°
HNBR 70: -40° to +300F°
Kalrez (DuPont/Dow): up to 428F°
Silicone: -80F to +400F°
PTFE (Teflon): -300° to +450F°
So... unless you are aware of a material not described in the above... you're limits will be determined by the lowest temperature tolerance of the individual components.