When soldering a surface mount chip like a voltage regulator onto a circuit board I have seen two methods. In one method recommended by madvapes, they suggest tinning each pad on the Circuit Board and then positioning the regulator SMD chip to align with the pads, hold it in place an then heat the top of each pin until the solder reflows and makes the connection for each pin one at a time.
However, watching a Youtube video by the EEVblog about SMD about tack and reflow soldering, Dave Jones, the host uses a different approach. He only tacks 1 pin onto the board to anchor the chip and then separately solders each pin one at a time.
Is there any advantage in one technique over the other? Does anyone know what I am talking about?
The video I watched was: EEVblog #186 - Soldering Tutorial Part 3 - Surface Mount - YouTube
However, watching a Youtube video by the EEVblog about SMD about tack and reflow soldering, Dave Jones, the host uses a different approach. He only tacks 1 pin onto the board to anchor the chip and then separately solders each pin one at a time.
Is there any advantage in one technique over the other? Does anyone know what I am talking about?
The video I watched was: EEVblog #186 - Soldering Tutorial Part 3 - Surface Mount - YouTube